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Your position:  Home / sapphire substrate / 188634
8inch SiC wafer silicon carbide wafer 4H-N 4H-SEMI HPSI type dummy grade prime grade research grade 500±25um
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8inch SiC wafer silicon carbide wafer 4H-N 4H-SEMI HPSI type dummy grade prime grade research grade 500±25um

Sku. 188634
$ 1,030 $ 1,100 save   $70

Grade*

Dummy grade prime/production grade（Mos） prime/production grade（SBD） Research grade

Type*

4H-N 4H-SEMI HPSI
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Estimated delivery time : 4-7 working days. See details
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8inch SiC wafer silicon carbide wafer 4H-N 4H-SEMI HPSI type dummy grade prime grade research grade 500±25um

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8inch SiC wafer silicon carbide wafer 4H-N 4H-SEMI HPSI type dummy grade prime grade research grade 500±25um

8inch SiC wafer silicon carbide wafer 4H-N 4H-SEMI HPSI type dummy grade prime grade research grade 500±25um

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Abstract

This 8-inch (200 mm) silicon carbide (SiC) wafer is designed to meet the rigorous demands of advanced electronic and power device manufacturing. Offered in two grades—Zero MPD and Dummy—it features industry-leading micropipe density (MPD), exceptional surface quality, and precise mechanical properties. Its versatile design is optimized for applications such as high-power semiconductors, electric vehicles, and renewable energy systems.

Properties

ParameterZero MPD GradeDummy Grade
Diameter199.5–200 mm199.5–200 mm
Thickness500 μm ± 25 μm350 μm ± 25 μm
Wafer OrientationOff-axis: 4.0° toward <11-20> ± 0.5°Off-axis: 4.0° toward <11-20> ± 0.5°
Micropipe Density (MPD)<0.5 cm⁻²<30 cm⁻²
TTV / Bow / Warp<10 μm / ±35 μm / <70 μm<15 μm / ±50 μm / <100 μm
Electrical Resistivity0.015–0.028 Ω·cmN/A
Notch{10-10} ± 5.0°{10-10} ± 5.0°
Edge Exclusion3 mm3 mm
Surface RoughnessOptical Polish: Ra ≤ 1 nmOptical Polish: Ra ≤ 1 nm
CMP (Si Face): Ra ≤ 0.5 nmCMP (Si Face): Ra ≤ 0.5 nm
CracksNoneCumulative length ≤ 30 mm, single ≤ 2 mm
Hex PlatesCumulative area ≤ 0.05%Cumulative area ≤ 0.1%
Polytype AreasNoneCumulative area ≤ 3%
ScratchesNone5 scratches ≤ 1× wafer diameter cumulative length
Edge ChipsNone permitted (>0.2 mm width & depth)9 allowed, ≤1 mm each
ContaminationNoneNone

Applications

  1. Power Electronics: Suitable for high-power devices like MOSFETs, IGBTs, and thyristors, providing enhanced performance, thermal conductivity, and energy efficiency.
  2. Automotive: Supports electric vehicle (EV) and hybrid electric vehicle (HEV) applications by enabling compact, efficient, and high-reliability inverters and converters.
  3. Renewable Energy Systems: Optimized for use in solar inverters and wind turbines, delivering superior energy conversion efficiency and reliability.
  4. Telecommunications: Critical for RF and microwave devices used in 5G and advanced communication systems.
  5. Industrial Applications: Supports energy-efficient industrial motor drives and power systems.

Summary

The 8-inch SiC wafer is a cutting-edge material tailored for high-performance applications. The Zero MPD Grade ensures defect-free surfaces for demanding electronic devices, while the Dummy Grade offers a cost-effective solution for testing and process development. Its advanced mechanical and electrical properties make it indispensable for modern semiconductor technologies.

Item4H n-type SiC substrate（2~8inch）
Diameter50.8±0.3mm76.2±0.3mm100.0±0.3mm150.0±0.5mm200.0±0.5mm
Thickness350±25μm350±25μm350±25μm350±25μm500±25μm
Surface OrientationOff-Axis：4°toward <11-20>±0.5°
Primary Flat OrientationParallel to <11-20>±1°<1-100>±1°
Primary Flat Length16.0±1.5mm22.0±1.5mm32.5±2.0mm47.5±2.0mmNotch
Secondary Flat OrientationSilicon face up: 90° CW. from Primary flat±5.0°N/AN/A
Secondary Flat Length8.0±1.5mm11.0±1.5mm18.0±2.0mmN/AN/A
Resistivity0.014～0.028Ω•cm
Front Surface FinishSi-Face: CMP, Ra<0.5nm
Back Surface FinishC-Face: Optical Polish, Ra<1.0nm
Laser MarkBack side: C-Face
TTV≤10μm≤15μm≤15μm≤15μm≤20μm
BOW≤25μm≤25μm≤30μm≤40μm≤60μm
WARP≤30μm≤35μm≤40μm≤60μm≤80μm
Edge Exclusion≤3 mm
ParameterPrime GradeDummy Grade
Diameter199.5–200 mm199.5–200 mm
Thickness500 μm ± 25 μm350 μm ± 25 μm
Wafer OrientationOff axis: 4.0° toward <11-20> ± 0.5°Off axis: 4.0° toward <11-20> ± 0.5°
Micropipe Density (MPD)<0.5 cm⁻²<30 cm⁻²
TTV / Bow / Warp<10 μm / ±35 μm / <70 μm<15 μm / ±50 μm / <100 μm
Electrical Resistivity (Ω·cm)0.015–0.028N/A
Notch{10-10} ± 5.0°{10-10} ± 5.0°
Edge Exclusion3 mm3 mm
Surface Roughness
- Optical PolishRa ≤ 1 nmRa ≤ 1 nm
- CMP (Si Face)Ra ≤ 0.5 nmRa ≤ 0.5 nm
Cracks (by High Intensity Light)NoneCumulative length ≤ 30 mm, single length ≤ 2 mm
Hex Plates (by High Intensity Light)Cumulative area ≤ 0.05%Cumulative area ≤ 0.1%
Polytype Areas (by High Intensity Light)NoneCumulative area ≤ 3%
Scratches (by High Intensity Light)None5 scratches ≤ 1× wafer diameter cumulative length
Edge ChipsNone permitted (>0.2 mm width & depth)9 allowed, ≤1 mm each
Contamination (by High Intensity Light)NoneNone

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  • Shipping Policy

    Our products are shipped from China, the dispatching date will be commenced in few business days after the finishing of QC from the related department.
    Detailed tracking information will be offered to your mailbox in an automatic manner as long as we officially dispatched your package from our sorting center.
    Customer is advised to check more tracking information from “My Account” after the account sign in.
    It occasionally comes to the situation for no displaying of tracking information after the receiving of shipment notification. Please be advised to wait for 1-2 business days until the updating of pertinent tracking information in your account center.

  • Expedited shipment

    The changing of the shipping methods may have occurred when we are noticed from customer for the needing of rush order or lower rate of shipment delay. The related request is acceptable whenever in prior of the order is dispatched and heading to the designated shipping address.
    Note: (PO) boxes or FPO/APO military addresses can only be shipped out by standard shipping method).
    The shipping fare for the expedited shipment method may higher than the standard one you chose for, then please be aware that you may ask to pay for the balance for the pertinent shipment substitution. You are welcome to contact our customer service via “contact us” for further inquiry and requisition.

  • Shipping cost all about

    It is deeply appreciated to take your kind pardon for any misunderstanding about the shipping price due to the package is shipped from China.
    The contract we have stipulated with FedEx, DHL, UPS and EMS is already set and therefore all merchandise is sent via Air rather than Ground. While this may not be the most cost effective for all customers, in terms of delivery time, ease of shipment and reliability we have determined that this is the most effective overall.
    The shipping cost for all merchandises are displayed by adding items to your shipping bag, you can estimate shipping time and cost and acquire more shipping cost information from our site.

  • International Shipping

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